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1 tm file number 4805.8 caution: these devices are sensitive to electrostatic discharge; follow proper ic handling procedures. 1-888-intersil or 321-724-7143 | intersil and design is a trademark of intersil americas inc. copyright ? intersil americas inc. 2001, all rights reserved icl3221, icl3222, icl3223, icl3232, icl3241, icl3243 1 microamp supply-current, +3v to +5.5v, 250kbps, rs-232 transmitters/receivers the intersil icl32xx devices are 3.0v to 5.5v powered rs-232 transmitters/receivers which meet ela/tia-232 and v.28/v.24 specifications, even at v cc = 3.0v. targeted applications are pdas, palmtops, and notebook and laptop computers where the low operational, and even lower standby, power consumption is critical. efficient on-chip charge pumps, coupled with manual and automatic powerdown functions (except for the icl3232), reduce the standby supply current to a 1 a trickle. small footprint packaging, and the use of small, low value capacitors ensure board space savings as well. data rates greater than 250kbps are guaranteed at worst case load conditions. this family is fully compatible with 3.3v only systems, mixed 3.3v and 5.0v systems, and 5.0v only systems. the icl324x are 3 driver, 5 receiver devices that provide a complete serial port suitable for laptop or notebook computers. both devices also include noninverting always- active receivers for ?wake-up? capability. the icl3221, icl3223 and icl3243, feature an automatic powerdown function which powers down the on-chip power- supply and driver circuits. this occurs when an attached peripheral device is shut off or the rs-232 cable is removed, conserving system power automatically without changes to the hardware or operating system. these devices power up again when a valid rs-232 voltage is applied to any receiver input. table 1 summarizes the features of the devices represented by this data sheet, while application note an9863 summarizes the features of each device comprising the icl32xx 3v family. features drop in replacements for max3221, max3222, max3223, max3232, max3241, max3243, sp3243 icl3221 is low power, pin compatible upgrade for 5v max221 icl3222 is low power, pin compatible upgrade for 5v max242, and sp312a icl3232 is low power upgrade for hin232/icl232 and pin compatible competitor devices meets eia/tia-232 and v.28/v.24 specifications at 3v latch-up free on-chip voltage converters require only four external 0.1 f capacitors manual and automatic powerdown features (except icl3232) guaranteed mouse driveability (icl324x only) receiver hysteresis for improved noise immunity guaranteed minimum data rate . . . . . . . . . . . . . 250kbps guaranteed minimum slew rate . . . . . . . . . . . . . . . 6v/ s wide power supply range . . . . . . . single +3v to +5.5v low supply current in powerdown state. . . . . . . . . . .1 a applications any system requiring rs-232 communication ports - battery powered, hand-held, and portable equipment - laptop computers, notebooks, palmtops - modems, printers and other peripherals - digital cameras - cellular/mobile phones table 1. summary of features part number no. of tx. no. of rx. no. of monitor rx. (r outb ) data rate (kbps) rx. enable function? ready output? manual power- down? automatic powerdown function? icl3221 1 1 0 250 yes no yes yes icl3222 2 2 0 250 yes no yes no icl3223 2 2 0 250 yes no yes yes icl3232 2 2 0 250 no no no no icl3241 3 5 2 250 yes no yes no icl3243 3 5 1 250 no no yes yes data sheet september 2001 itle l322 l322 l322 l323 l324 l324 b- t (1 cro- p pply- r- t, v to .5v, 0kbps s- 2 ns- t- s/rec ers) uthor ey- rds tersil rpo- ion,
2 ordering information (note 1) part no. temp. range ( o c) package pkg. no. icl3221ca 0 to 70 16 ld ssop m16.209 icl3221ia -40 to 85 16 ld ssop m16.209 icl3221cv 0 to 70 16 ld tssop m16.173 icl3222ca 0 to 70 20 ld ssop m20.209 icl3222ia -40 to 85 20 ld ssop m20.209 icl3222cb 0 to 70 18 ld soic m18.3 icl3222ib -40 to 85 18 ld soic m18.3 icl3222cp 0 to 70 18 ld pdip e18.3 icl3222cv 0 to 70 20 ld tssop m20.173 icl3222iv -40 to 85 20 ld tssop m20.173 icl3223ca 0 to 70 20 ld ssop m20.209 icl3223ia -40 to 85 20 ld ssop m20.209 icl3223cp 0 to 70 20 ld pdip e20.3 icl3223cv 0 to 70 20 ld tssop m20.173 icl3223iv -40 to 85 20 ld tssop m20.173 icl3232ca 0 to 70 16 ld ssop m16.209 icl3232ia -40 to 85 16 ld ssop m16.209 icl3232cb 0 to 70 16 ld soic m16.3 icl3232cbn 0 to 70 16 ld soic (n) m16.15 icl3232ibn -40 to 85 16 ld soic (n) m16.15 icl3232ib -40 to 85 16 ld soic m16.3 icl3232cp 0 to 70 16 ld pdip e16.3 icl3232cv 0 to 70 16 ld tssop m16.173 icl3232iv -40 to 85 16 ld tssop m16.173 icl3241ca 0 to 70 28 ld ssop m28.209 icl3241ia -40 to 85 28 ld ssop m28.209 icl3241cb 0 to 70 28 ld soic m28.3 icl3241ib -40 to 85 28 ld soic m28.3 icl3241cv 0 to 70 28 ld tssop m28.173 icl3241iv -40 to 85 28 ld tssop m28.173 ICL3243CA 0 to 70 28 ld ssop m28.209 icl3243ia -40 to 85 28 ld ssop m28.209 icl3243cb 0 to 70 28 ld soic m28.3 icl3243ib -40 to 85 28 ld soic m28.3 icl3243cv 0 to 70 28 ld tssop m28.173 icl3243iv -40 to 85 28 ld tssop m28.173 note: 1. most surface mount devices are available on tape and reel; add ?-t? to suffix. ordering information (continued) (note 1) part no. temp. range ( o c) package pkg. no. pinouts icl3221 (ssop, tssop) top view icl3222 (pdip, soic) top view en c1+ v+ c1- c2+ c2- v- r1 in forceoff gnd t1 out forceon t1 in r1 out v cc invalid 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 en c1+ v+ c1- c2+ c2- v- t2 out r2 in shdn gnd t1 out r1 in r1 out t2 in v cc t1 in r2 out 18 17 16 15 14 13 12 11 10 1 2 3 4 5 6 7 8 9 icl3221, icl3222, icl3223, icl3232, icl3241, icl3243
3 icl3222 (ssop, tssop) top view icl3223 (pdip, ssop, tssop) top view icl3232 (pdip, soic, ssop, tssop) top view icl3241 (soic, ssop, tssop) top view icl3243 (soic, ssop, tssop) top view pinouts (continued) en c1+ v+ c1- c2+ c2- v- t2 out r2 in shdn gnd t1 out r1 in r1 out t1 in nc v cc nc t2 in 20 19 18 17 16 15 14 13 12 11 1 2 3 4 5 6 7 8 9 10 r2 out en c1+ v+ c1- c2+ c2- v- t2 out r2 in forceoff gnd t1 out r1 in r1 out t1 in invalid v cc forceon t2 in 20 19 18 17 16 15 14 13 12 11 1 2 3 4 5 6 7 8 9 10 r2 out c1+ v+ c1- c2+ c2- v- t2 out r2 in v cc t1 out r1 in r1 out t1 in r2 out gnd t2 in 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 c2+ c2- v- r1 in r2 in r3 in r4 in r5 in t1 out t3 out t3 in t2 in t1 in c1+ v cc gnd c1- en r1 outb r1 out r2 out r3 out r4 out r5 out v+ shdn r2 outb 28 27 26 25 24 23 22 21 20 19 18 17 16 15 1 2 3 4 5 6 7 8 9 10 11 12 13 14 t2 out c2+ c2- v- r1 in r2 in r3 in r4 in r5 in t1 out t3 out t3 in t2 in t1 in c1+ v cc gnd c1- forceon invalid r1 out r2 out r3 out r4 out r5 out v+ forceoff r2 outb 28 27 26 25 24 23 22 21 20 19 18 17 16 15 1 2 3 4 5 6 7 8 9 10 11 12 13 14 t2 out icl3221, icl3222, icl3223, icl3232, icl3241, icl3243
4 pin descriptions pin function v cc system power supply input (3.0v to 5.5v). v+ internally generated positive transmitter supply (+5.5v). v- internally generated negative transmitter supply (-5.5v). gnd ground connection. c1+ external capacitor (voltage doubler) is connected to this lead. c1- external capacitor (voltage doubler) is connected to this lead. c2+ external capacitor (voltage inverter) is connected to this lead. c2- external capacitor (voltage inverter) is connected to this lead. t in ttl/cmos compatible transmitter inputs. t out rs-232 level (nominally 5.5v) transmitter outputs. r in rs-232 compatible receiver inputs. r out ttl/cmos level receiver outputs. r outb ttl/cmos level, noninverting, always enabled receiver outputs. invalid active low output that indicates if no valid rs-232 levels are present on any receiver input. en active low receiver enable control; doesn?t disable r outb outputs. shdn active low input to shut down transmitters and on-board power supply, to place device in low power mode. forceoff active low to shut down transmitters and on-chip power supply. this overrides any automatic circuitry and forceon (see table 2) . forceon active high input to override automatic powerdown circuitry thereby keeping transmitters active. (forceoff must be high). icl3221, icl3222, icl3223, icl3232, icl3241, icl3243
5 typical operating circuits icl3221 icl3222 icl3223 icl3232 15 v cc t1 out t1 in t 1 0.1 f + 0.1 f + 0.1 f 11 13 2 4 3 7 v+ v- c1+ c1- c2+ c2- + 0.1 f 5 6 r1 out r1 in r 1 8 9 5k ? c 1 c 2 + c 3 c 4 en 1 gnd +3.3v + 0.1 f 14 ttl/cmos logic levels rs-232 levels forceon forceoff 12 16 v cc 10 invalid to power control logic + c 3 (optional connection, note) note: the negative terminal of c 3 can be connected to either v cc or gnd 17 v cc t1 out t2 out t1 in t2 in t 1 t 2 0.1 f + 0.1 f + 0.1 f 12 11 15 8 2 4 3 7 v+ v- c1+ c1- c2+ c2- + 0.1 f 5 6 r1 out r1 in 14 5k ? r2 out r2 in 9 10 5k ? 13 c 1 c 2 + c 3 c 4 en shdn 1 gnd 18 +3.3v + 0.1 f 16 v cc ttl/cmos logic levels rs-232 levels r 1 r 2 + c 3 (optional connection, note) note: the negative terminal of c 3 can be connected to either v cc or gnd 19 v cc t1 out t2 out t1 in t2 in t 1 t 2 0.1 f + 0.1 f + 0.1 f 13 12 17 8 2 4 3 7 v+ v- c1+ c1- c2+ c2- + 0.1 f 5 6 r1 out r1 in 16 5k ? r2 out r2 in 9 10 5k ? 15 c 1 c 2 + c 3 c 4 en 1 gnd +3.3v + 0.1 f 18 ttl/cmos logic levels rs-232 levels r 1 r 2 forceon forceoff 14 20 v cc 11 invalid to power control logic 16 v cc t1 out t2 out t1 in t2 in t 1 t 2 0.1 f + 0.1 f + 0.1 f 11 10 14 7 1 3 2 6 v+ v- c1+ c1- c2+ c2- + 0.1 f 4 5 r1 out r1 in 13 5k ? r2 out r2 in 8 9 5k ? 12 c 1 c 2 + c 3 c 4 gnd +3.3v + 0.1 f 15 ttl/cmos logic levels rs-232 levels r 1 r 2 + c 3 (optional connection, note) note: the negative terminal of c 3 can be connected to either v cc or gnd icl3221, icl3222, icl3223, icl3232, icl3241, icl3243
6 icl3241 icl3243 typical operating circuits (continued) 26 v cc t1 out t2 out t3 out t1 in t2 in t3 in t 1 t 2 t 3 0.1 f + 0.1 f + 0.1 f 14 13 9 10 12 11 28 24 27 3 v+ v- c1+ c1- c2+ c2- + 0.1 f 1 2 r1 out r1 in 4 5k ? r2 out r2 in 5 18 5k ? r3 out r3 in 6 17 5k ? r4 out r4 in 7 16 5k ? r5 out r5 in r 5 8 15 5k ? 19 r2 outb c 1 c 2 + c 3 c 4 en shdn 23 gnd 22 +3.3v + 0.1 f 20 25 v cc ttl/cmos logic levels rs-232 levels rs-232 levels r1 outb 21 r 1 r 2 r 3 r 4 26 v cc t1 out t2 out t3 out t1 in t2 in t3 in t 1 t 2 t 3 0.1 f + 0.1 f + 0.1 f 14 13 9 10 12 11 28 24 27 3 v+ v- c1+ c1- c2+ c2- + 0.1 f 1 2 r1 out r1 in 4 5k ? r2 out r2 in 5 18 5k ? r3 out r3 in 6 17 5k ? r4 out r4 in 7 16 5k ? r5 out r5 in r 5 8 15 5k ? 19 r2 outb c 1 c 2 + c 3 c 4 forceon forceoff 23 gnd 22 +3.3v + 0.1 f 20 25 v cc ttl/cmos logic levels rs-232 levels rs-232 levels r 1 r 2 r 3 r 4 21 invalid to power control logic icl3221, icl3222, icl3223, icl3232, icl3241, icl3243
7 absolute maximum ratings thermal information v cc to ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3v to 6v v+ to ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3v to 7v v- to ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3v to -7v v+ to v- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14v input voltages t in , forceoff , forceon, en , shdn . . . . . . . . . -0.3v to 6v r in . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25v output voltages t out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.2v r out , invalid . . . . . . . . . . . . . . . . . . . . . . . . -0.3v to v cc +0.3v short circuit duration t out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . continuous esd rating . . . . . . . . . . . . . . . . . . . . . . . . . see specification table operating conditions temperature range icl32xxcx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 o c to 70 o c icl32xxix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40 o c to 85 o c thermal resistance (typical, note 2) ja ( o c/w) 16 ld pdip package . . . . . . . . . . . . . . . . . . . . . . . . 90 18 ld pdip package . . . . . . . . . . . . . . . . . . . . . . . . 80 20 ld pdip package . . . . . . . . . . . . . . . . . . . . . . . . 77 16 ld wide soic package . . . . . . . . . . . . . . . . . . . 100 16 ld narrow soic package. . . . . . . . . . . . . . . . . . 115 18 ld soic package . . . . . . . . . . . . . . . . . . . . . . . . 75 28 ld soic package . . . . . . . . . . . . . . . . . . . . . . . . 75 16 ld ssop package . . . . . . . . . . . . . . . . . . . . . . . 135 20 ld ssop package . . . . . . . . . . . . . . . . . . . . . . . 122 16 ld tssop package . . . . . . . . . . . . . . . . . . . . . . 145 20 ld tssop package . . . . . . . . . . . . . . . . . . . . . . 140 28 ld ssop and tssop packages . . . . . . . . . . . . 100 moisture sensitivity (see technical brief tb363) all packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . level 1 maximum junction temperature (plastic package) . . . . . . . 150 o c maximum storage temperature range . . . . . . . . . . -65 o c to 150 o c maximum lead temperature (soldering 10s) . . . . . . . . . . . . 300 o c (soic, ssop, tssop - lead tips only) caution: stresses above those listed in ?absolute maximum ratings? may cause permanent damage to the device. this is a stress o nly rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. note: 2. ja is measured with the component mounted on a low effective thermal conductivity test board in free air. see tech brief tb379 fo r details. electrical specifications tes t c on di tio ns : v cc = 3v to 5.5v, c 1 - c 4 = 0.1 f; unless otherwise specified. typicals are at t a = 25 o c parameter test conditions temp ( o c) min typ max units dc characteristics supply current, automatic powerdown all r in open, forceon = gnd, forceoff =v cc (icl3221, icl3223, icl3243 only) 25 - 1.0 10 a supply current, powerdown forceoff = shdn = gnd (except icl3232) 25 - 1.0 10 a supply current, automatic powerdown disabled all outputs unloaded, forceon = forceoff = shdn =v cc v cc = 3.15v, icl3221-32 25 - 0.3 1.0 ma v cc = 3.0v, icl3241-43 25 - 0.3 1.0 ma logic and transmitter inputs and receiver outputs input logic threshold low t in , forceon, forceoff , en , shdn full - - 0.8 v input logic threshold high t in , forceon, forceoff , en , shdn v cc = 3.3v full 2.0 - - v v cc = 5.0v full 2.4 - - v input leakage current t in , forceon, forceoff , en , shdn full - 0.01 1.0 a output leakage current (except icl3232) forceoff = gnd or en =v cc full - 0.05 10 a output voltage low i out = 1.6ma full - - 0.4 v output voltage high i out = -1.0ma full v cc -0.6 v cc -0.1 - v automatic powerdown (icl3221, icl3223, icl3243 only, forceon = gnd, forceoff = v cc ) receiver input thresholds to enable transmitters icl32xx powers up (see figure 6) full -2.7 - 2.7 v receiver input thresholds to disable transmitters icl32xx powers down (see figure 6) full -0.3 - 0.3 v invalid output voltage low i out = 1.6ma full - - 0.4 v invalid output voltage high i out = -1.0ma full v cc -0.6 - - v receiver threshold to transmitters enabled delay (t wu ) 25 - 100 - s icl3221, icl3222, icl3223, icl3232, icl3241, icl3243
8 receiver positive or negative threshold to invalid high delay (t invh ) 25 - 1 - s receiver positive or negative threshold to invalid low delay (t invl ) 25 - 30 - s receiver inputs input voltage range full -25 - 25 v input threshold low v cc = 3.3v 25 0.6 1.2 - v v cc = 5.0v 25 0.8 1.5 - v input threshold high v cc = 3.3v 25 - 1.5 2.4 v v cc = 5.0v 25 - 1.8 2.4 v input hysteresis 25 - 0.3 - v input resistance 25 3 5 7 k ? transmitter outputs output voltage swing all transmitter outputs loaded with 3k ? to ground full 5.0 5.4 - v output resistance v cc =v+=v-=0v, transmitter output= 2v full 300 10m - ? output short-circuit current full - 35 60 ma output leakage current v out = 12v, v cc = 0v or 3v to 5.5v automatic powerdown or forceoff = shdn =gnd full - - 25 a mouse driveability (icl324x only) transmitter output voltage (see figure 9) t1 in =t2 in = gnd, t3 in =v cc , t3 out loaded with 3k ? to gnd, t1 out and t2 out loaded with 2.5ma each full 5- -v timing characteristics maximum data rate r l =3k ?, c l = 1000pf, one transmitter switching full 250 500 - kbps receiver propagation delay receiver input to receiver output, c l = 150pf t phl 25 - 0.3 - s t plh 25 - 0.3 - s receiver output enable time normal operation (except icl3232) 25 - 200 - ns receiver output disable time normal operation (except icl3232) 25 - 200 - ns transmitter skew t phl - t plh full - 200 1000 ns receiver skew t phl - t plh full - 100 500 ns transition region slew rate v cc =3.3v, r l =3k ? to 7k ?, measured from 3v to -3v or -3v to 3v c l = 200pf to 2500pf 25 4 8.0 30 v/ s c l = 200pf to 1000pf 25 6 - 30 v/ s esd performance rs-232 pins (t out , r in ) human body model icl3221 - icl3243 25 - > 8-kv iec1000-4-2 contact discharge icl3221 - icl3243 25 - 8-kv iec1000-4-2 air gap discharge icl3221 - icl3232 25 - 8-kv icl3241 - icl3243 25 - 6-kv all other pins human body model icl3221 - icl3243 25 - 2-kv electrical specifications tes t c on di tio ns : v cc = 3v to 5.5v, c 1 - c 4 = 0.1 f; unless otherwise specified. typicals are at t a = 25 o c (continued) parameter test conditions temp ( o c) min typ max units icl3221, icl3222, icl3223, icl3232, icl3241, icl3243
9 detailed description icl32xx interface ics operate from a single +3v to +5.5v supply, guarantee a 250kbps minimum data rate, require only four small external 0.1 f capacitors, feature low power consumption, and meet all ela rs-232c and v.28 specifications. the circuit is divided into three sections: the charge pump, the transmitters, and the receivers. charge-pump intersil?s new icl32xx family utilizes regulated on-chip dual charge pumps as voltage doublers, and voltage inverters to generate 5.5v transmitter supplies from a v cc supply as low as 3.0v. this allows these devices to maintain rs-232 compliant output levels over the 10% tolerance range of 3.3v powered systems. the efficient on-chip power supplies require only four small, external 0.1 f capacitors for the voltage doubler and inverter functions at v cc = 3.3v. see the ?capacitor selection? section, and table 3 for capacitor recommendations for other operating conditions. the charge pumps operate discontinuously (i.e., they turn off as soon as the v+ and v- supplies are pumped up to the nominal values), resulting in significant power savings. transmitters the transmitters are proprietary, low dropout, inverting drivers that translate ttl/cmos inputs to eia/tia-232 output levels. coupled with the on-chip 5.5v supplies, these transmitters deliver true rs-232 levels over a wide range of single supply system voltages. except for the icl3232, all transmitter outputs disable and assume a high impedance state when the device enters the powerdown mode (see table 2). these outputs may be driven to 12v when disabled. all devices guarantee a 250kbps data rate for full load conditions (3k ? and 1000pf), v cc 3.0v, with one transmitter operating at full speed. under more typical conditions of v cc 3.3v, r l =3k ? , and c l = 250pf, one transmitter easily operates at 900kbps. transmitter inputs float if left unconnected, and may cause i cc increases. connect unused inputs to gnd for the best performance. receivers all the icl32xx devices contain standard inverting receivers that tristate (except for the icl3232) via the en or forceoff control lines. additionally, the two icl324x products include noninverting (monitor) receivers (denoted by the r outb label) that are always active, regardless of the state of any control lines. all the receivers convert rs-232 signals to cmos output levels and accept inputs up to 25v while presenting the required 3k ? to 7k ? input impedance (see figure 1) even if the power is off (v cc = 0v). the receivers? schmitt trigger input stage uses hysteresis to increase noise immunity and decrease errors due to slow input signal transitions. the icl3221/22/23/41 inverting receivers disable only when en is driven high. icl3243 receivers disable during forced (manual) powerdown, but not during automatic powerdown (see table 2). icl324x monitor receivers remain active even during manual powerdown and forced receiver disable, making them extremely useful for ring indicator monitoring. standard receivers driving powered down peripherals must be disabled to prevent current flow through the peripheral?s protection diodes (see figures 2 and 3). this renders them useless for wake up functions, but the corresponding monitor receiver can be dedicated to this task as shown in figure 3. low power operation these 3v devices require a nominal supply current of 0.3ma, even at v cc = 5.5v, during normal operation (not in powerdown mode). this is considerably less than the 5ma to 11ma current required by comparable 5v rs-232 devices, allowing users to reduce system power simply by switching to this new family. pin compatible replacements for 5v devices the icl3221/22/32 are pin compatible with existing 5v rs-232 transceivers - see the ?features? section on the front page for details. this pin compatibility coupled with the low icc and wide operating supply range, make the icl32xx potential lower power, higher performance drop-in replacements for existing 5v applications. as long as the 5v rs-232 output swings are acceptable, and transmitter input pull-up resistors aren?t required, the icl32xx should work in most 5v applications. when replacing a device in an existing 5v application, it is acceptable to terminate c 3 to v cc as shown on the ?typical operating circuit?. nevertheless, terminate c 3 to gnd if possible, as slightly better performance results from this configuration. powerdown functionality (except icl3232) the already low current requirement drops significantly when the device enters powerdown mode. in powerdown, supply current drops to 1 a, because the on-chip charge pump turns off (v+ collapses to v cc , v- collapses to gnd), and the transmitter outputs tristate. inverting receiver outputs may or may not disable in powerdown; refer to table 2 for details. this micro-power mode makes these devices ideal for battery powered and portable applications. software controlled (manual) powerdown r xout gnd v rout v cc 5k ? r xin -25v v rin +25v gnd v cc figure 1. inverting receiver connections icl3221, icl3222, icl3223, icl3232, icl3241, icl3243
10 most devices in the icl32xx family provide pins that allow the user to force the ic into the low power, standby state. on the icl3222 and icl3241, the powerdown control is via a simple shutdown (shdn ) pin. driving this pin high enables normal operation, while driving it low forces the ic into it?s powerdown state. connect shdn to v cc if the powerdown function isn?t needed. note that all the receiver outputs remain enabled during shutdown (see table 2). for the lowest power consumption during powerdown, the receivers should also be disabled by driving the en input high (see next section, and figures 2 and 3). the icl3221, icl3223, and icl3243 ut ilize a two pin approach where the forceon and forceoff inputs determine the ic?s mode. for always enabled operation, forceon and forceoff are both strapped high. to switch between active and powerdown modes, under logic or software control, only the forceoff input need be driven. the forceon state isn?t critical, as forceoff dominates over forceon. nevertheless, if strictly manual control over powerdown is desired, the user must strap forceon high to disable the automatic powerdown circuitry. inverting (standard) receiver outputs also disable when the device is in powerdown, thereby eliminating the possible current path through a shutdown peripheral?s input protection diode (see figures 2 and 3). table 2. powerdown and enable logic truth table rs-232 signal present at receiver input? forceoff or shdn input forceon input en input transmitter outputs receiver outputs (note 3) r outb outputs invalid output mode of operation icl3222, icl3241 n.a. l n.a. l high-z active active n.a. manual powerdown n.a. l n.a. h high-z high-z active n.a. manual powerdown w/rcvr. disabled n.a. h n.a. l active active active n.a. normal operation n.a. h n.a. h active high-z active n.a. normal operation w/rcvr. disabled icl3221, icl3223 no h h l active active n.a. l normal operation (auto powerdown disabled) no h h h active high-z n.a. l yes h l l active active n.a. h normal operation (auto powerdown enabled) yes h l h active high-z n.a. h no h l l high-z active n.a. l powerdown due to auto powerdown logic no h l h high-z high-z n.a. l yes l x l high-z active n.a. h manual powerdown yes l x h high-z high-z n.a. h manual powerdown w/rcvr. disabled no l x l high-z active n.a. l manual powerdown no l x h high-z high-z n.a. l manual powerdown w/rcvr. disabled icl3243 no h h n.a. active active active l normal operation (auto powerdown disabled) yes h l n.a. active active active h normal operation (auto powerdown enabled) no h l n.a. high-z active active l powerdown due to auto powerdown logic yes l x n.a. high-z high-z active h manual powerdown no l x n.a. high-z high-z active l manual powerdown note: 3. applies only to the icl3241 and icl3243. icl3221, icl3222, icl3223, icl3232, icl3241, icl3243
11 the invalid output always indicates whether or not a valid rs-232 signal is present at any of the receiver inputs (see table 2), giving the user an easy way to determine when the interface block should power down. in the case of a disconnected interface cable where all the receiver inputs are floating (but pulled to gnd by the internal receiver pull down resistors), the invalid logic detects the invalid levels and drives the output low. the power management logic then uses this indicator to power down the interface block. reconnecting the cable restores valid levels at the receiver inputs, invalid switches high, and the power management logic wakes up the interface block. invalid can also be used to indicate the dtr or ring indicator signal, as long as the other receiver inputs are floating, or driven to gnd (as in the case of a powered down driver). connecting forceoff and forceon together disables the automatic powerdown feature, enabling them to function as a manual shutdown input (see figure 4). with any of the above control schemes, the time required to exit powerdown, and resume transmission is only 100 s. a mouse, or other application, may need more time to wake up from shutdown. if automatic powerdown is being utilized, the rs-232 device will reenter powerdown if valid receiver levels aren?t reestablished within 30 s of the icl32xx powering up. figure 5 illustrates a circuit that keeps the icl32xx from initiating automatic powerdown for 100ms after powering up. this gives the slow-to-wake peripheral circuit time to reestablish valid rs-232 output levels. automatic powerdown (icl3221/23/43 only) even greater power savings is available by using the devices which feature an automatic powerdown function. when no valid rs-232 voltages (see figure 6) are sensed on any receiver input for 30 s, the charge pump and transmitters powerdown, thereby reducing supply current to 1 a. invalid receiver levels occur whenever the driving peripheral?s outputs are shut off (powered down) or when the rs-232 interface cable is disconnected. the icl32xx powers back up whenever it detects a valid rs-232 voltage level on any receiver input. this automatic powerdown feature provides additional system power savings without changes to the existing operating system. figure 2. power drain through powered down peripheral old v cc powered gnd shdn = gnd v cc rx tx v cc current v out = v cc flow rs-232 chip down uart figure 3. disabled receivers prevent power drain icl324x transition r x t x r2 outb r2 out t1 in forceoff = gnd v cc v cc to r2 in t1 out v out = hi-z powered or shdn = gnd, en = v cc detector down uart wake-up logic figure 4. connections for manual powerdown when no valid receiver signals are present pwr forceoff invalid cpu i/o forceon icl3221/23/43 mgt logic uart figure 5. circuit to prevent auto powerdown for 100ms after forced powerup icl3221/23/43 forceoff forceon power master powerdown line 1m ? 0.1 f management unit icl3221, icl3222, icl3223, icl3232, icl3241, icl3243
12 automatic powerdown operates when the forceon input is low, and the forceoff input is high. tying forceon high disables automatic powerdown, but manual powerdown is always available via the overriding forceoff input. table 2 summarizes the automatic powerdown functionality. devices with the automatic powerdown feature include an invalid output signal, which switches low to indicate that invalid levels have persisted on all of the receiver inputs for more than 30 s (see figure 7). invalid switches high 1 s after detecting a valid rs-232 level on a receiver input. invalid operates in all modes (forced or automatic powerdown, or forced on), so it is also useful for systems employing manual powerdown circuitry. when automatic powerdown is utilized, invalid = 0 indicates that the icl32xx is in powerdown mode. the time to recover from automatic powerdown mode is typically 100 s. receiver enable control (icl3221/22/23/41 only) several devices also feature an en input to control the receiver outputs. driving en high disables all the inverting (standard) receiver outputs placing them in a high impedance state. this is useful to eliminate supply current, due to a receiver output forward biasing the protection diode, when driving the input of a powered down (v cc = gnd) peripheral (see figure 2). the enable input has no effect on transmitter nor monitor (r outb ) outputs. capacitor selection the charge pumps require 0.1 f capacitors for 3.3v operation. for other supply voltages refer to table 3 for capacitor values. do not use values smaller than those listed in table 3. increasing the capacitor values (by a factor of 2) reduces ripple on the transmitter outputs and slightly reduces power consumption. c 2 , c 3 , and c 4 can be increased without increasing c 1 ?s value, however, do not increase c 1 without also increasing c 2 , c 3 , and c 4 to maintain the proper ratios (c 1 to the other capacitors). when using minimum required capacitor values, make sure that capacitor values do not degrade excessively with temperature. if in doubt, use capacitors with a larger nominal value. the capacitor?s equivalent series resistance (esr) usually rises at low temperatures and it influences the amount of ripple on v+ and v-. power supply decoupling in most circumstances a 0.1 f bypass capacitor is adequate. in applications that are particularly sensitive to power supply noise, decouple v cc to ground with a capacitor of the same value as the charge-pump capacitor c 1 . connect the bypass capacitor as close as possible to the ic. transmitter outputs when exiting powerdown figure 8 shows the response of two transmitter outputs when exiting powerdown mode. as they activate, the two transmitter outputs properly go to opposite rs-232 levels, with no glitching, ringing, nor undesirable transients. each transmitter is loaded with 3k ? in parallel with 2500pf. note that the transmitters enable only when the magnitude of the supplies exceed approximately 3v. figure 6. definition of valid rs-232 receiver levels 0.3v -0.3v -2.7v 2.7v invalid level - powerdown occurs after 30 s valid rs-232 level - icl32xx is active valid rs-232 level - icl32xx is active indeterminate - powerdown may or indeterminate - powerdown may or may not occur may not occur receiver inputs transmitter outputs invalid output v+ v cc 0 v- v cc 0 t invl t invh invalid region } figure 7. automatic powerdown and invalid timing diagrams autopwdn pwr up table 3. required capacitor values v cc (v) c 1 ( f) c 2 , c 3 , c 4 ( f) 3.0 to 3.6 0.1 0.1 4.5 to 5.5 0.047 0.33 3.0 to 5.5 0.1 0.47 icl3221, icl3222, icl3223, icl3232, icl3241, icl3243
13 mouse driveability the icl324x have been specifically designed to power a serial mouse while operating from low voltage supplies. figure 9 shows the transmitter output voltages under increasing load current. the on-chip switching regulator ensures the transmitters will supply at least 5v during worst case conditions (15ma for paralleled v+ transmitters, 7.3ma for single v- transmitter). the automatic powerdown feature does not work with a mouse, so forceoff and forceon should be connected to v cc . high data rates the icl32xx maintain the rs-232 5v minimum transmitter output voltages even at high data rates. figure 10 details a transmitter loopback test circuit, and figure 11 illustrates the loopback test result at 120kbps. for this test, all transmitters were simultaneously driving rs-232 loads in parallel with 1000pf, at 120kbps. figure 12 shows the loopback results for a single transmitter driving 1000pf and an rs-232 load at 250kbps. the static transmitters were also loaded with an rs-232 receiver. time (20 s/div.) t1 t2 2v/div 5v/div v cc = +3.3v forceoff figure 8. transmitter outputs when exiting powerdown c1 - c4 = 0.1 f figure 9. transmitter output voltage vs load current (per transmitter, i.e., double current axis for total v out+ current) transmitter output voltage (v) load current per transmitter (ma) 0246810 -6 -4 -2 0 2 4 6 -5 -3 -1 1 3 5 13579 v out + v out - v cc v out + v out - t1 t2 t3 v cc = 3.0v icl3241/43 figure 10. transmitter loopback test circuit figure 11. loopback test at 120kbps figure 12. loopback test at 250kbps icl32xx v cc forceoff c 1 c 2 c 4 c 3 + + + + 1000pf v+ v- 5k t in r out c1+ c1- c2+ c2- r in t out + v cc 0.1 f v cc en shdn or t1 in t1 out r1 out 5 s/div. v cc = +3.3v 5v/div. c1 - c4 = 0.1 f t1 in t1 out r1 out 2 s/div. 5v/div. v cc = +3.3v c1 - c4 = 0.1 f icl3221, icl3222, icl3223, icl3232, icl3241, icl3243
14 interconnection with 3v and 5v logic the icl32xx directly interface with 5v cmos and ttl logic families. nevertheless, with the icl32xx at 3.3v, and the logic supply at 5v, ac, hc, and cd4000 outputs can drive icl32xx inputs, but icl32xx outputs do not reach the minimum v ih for these logic families. see table 4 for more information. table 4. logic family compatibility with various supply voltages system power-supply voltage (v) v cc supply voltage (v) compatibility 3.3 3.3 compatible with all cmos families. 5 5 compatible with all ttl and cmos logic families. 5 3.3 compatible with act and hct cmos, and with ttl. icl32xx outputs are incompatible with ac, hc, and cd4000 cmos inputs. typical performance curves v cc = 3.3v, t a = 25 o c figure 13. transmitter output voltage vs load capacitance figure 14. slew rate vs load capacitance figure 15. supply current vs load capacitance when transmitting data figure 16. supply current vs load capacitance when transmitting data -6 -4 -2 0 2 4 6 1000 2000 3000 4000 5000 0 load capacitance (pf) transmitter output voltage (v) 1 transmitter at 250kbps v out + v out - 1 or 2 transmitters at 30kbps load capacitance (pf) slew rate (v/ s) 0 1000 2000 3000 4000 5000 5 10 15 20 25 +slew -slew 0 5 10 15 20 25 30 45 35 40 0 1000 2000 3000 4000 5000 load capacitance (pf) supply current (ma) 20kbps 250kbps 120kbps icl3221 0 5 10 15 20 25 30 45 35 40 0 1000 2000 3000 4000 5000 load capacitance (pf) supply current (ma) 20kbps 250kbps 120kbps icl3222 - icl3232 icl3221, icl3222, icl3223, icl3232, icl3241, icl3243
15 die characteristics die dimensions: icl3221: 73 mils x 91 mils (1850 m x 2300 m) icl3222/23/32: 100 mils x 100 mils (2540 m x 2540 m) icl3241/43: 100 mils x 127 mils (2550 m x 3230 m) metallization: type: metal 1: aisi(1%) thickness: metal 1: 8k ? type: metal 2: aisi (1%) thickness: metal 2: 10k ? substrate potential (powered up): gnd passivation: type: silox thickness: 13k ? transistor count: icl3221: 286 icl3222: 338 icl3223: 357 icl3232: 296 icl324x: 464 process: si gate cmos figure 17. supply current vs load capacitance when transmitting data figure 18. supply current vs supply voltage typical performance curves v cc = 3.3v, t a = 25 o c (continued) 0 5 10 15 20 25 30 45 35 40 0 1000 2000 3000 4000 5000 load capacitance (pf) supply current (ma) 20kbps 250kbps 120kbps icl324x supply current (ma) 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 0 0.5 1.0 1.5 2.0 supply voltage (v) 2.5 3.0 3.5 no load all outputs static icl3221 - icl3232 icl324x icl324x icl3221, icl3222, icl3223, icl3232, icl3241, icl3243
16 dual-in-line plastic packages (pdip) notes: 1. controlling dimensions: inch. in case of conflict between english and metric dimensions, the inch dimensions control. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. symbols are defined in the ?mo series symbol list? in section 2.2 of publication no. 95. 4. dimensions a, a1 and l are measured with the package seated in je- dec seating plane gauge gs - 3. 5. d, d1, and e1 dimensions do not include mold flash or protrusions. mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. e and are measured with the leads constrained to be perpendic- ular to datum . 7. e b and e c are measured at the lead tips with the leads unconstrained. e c must be zero or greater. 8. b1 maximum dimensions do not include dambar protrusions. dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. n is the maximum number of terminal positions. 10. corner leads (1, n, n/2 and n/2 + 1) for e8.3, e16.3, e18.3, e28.3, e42.6 will have a b1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). e a -c- c l e e a c e b e c -b- e1 index 12 3 n/2 n area seating base plane plane -c- d1 b1 b e d d1 a a2 l a1 -a- 0.010 (0.25) c a m bs e16.3 (jedec ms-001-bb issue d) 16 lead dual-in-line plastic package symbol inches millimeters notes min max min max a - 0.210 - 5.33 4 a1 0.015 - 0.39 - 4 a2 0.115 0.195 2.93 4.95 - b 0.014 0.022 0.356 0.558 - b1 0.045 0.070 1.15 1.77 8, 10 c 0.008 0.014 0.204 0.355 - d 0.735 0.775 18.66 19.68 5 d1 0.005 - 0.13 - 5 e 0.300 0.325 7.62 8.25 6 e1 0.240 0.280 6.10 7.11 5 e 0.100 bsc 2.54 bsc - e a 0.300 bsc 7.62 bsc 6 e b - 0.430 - 10.92 7 l 0.115 0.150 2.93 3.81 4 n16 169 rev. 0 12/93 icl3221, icl3222, icl3223, icl3232, icl3241, icl3243
17 dual-in-line plastic packages (pdip) notes: 1. controlling dimensions: inch. in case of conflict between english and metric dimensions, the inch dimensions control. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. symbols are defined in the ?mo series symbol list? in section 2.2 of publication no. 95. 4. dimensions a, a1 and l are measured with the package seated in jedec seating plane gauge gs - 3. 5. d, d1, and e1 dimensions do not include mold flash or protrusions. mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. e and are measured with the leads constrained to be perpendic- ular to datum . 7. e b and e c are measured at the lead tips with the leads unconstrained. e c must be zero or greater. 8. b1 maximum dimensions do not include dambar protrusions. dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. n is the maximum number of terminal positions. 10. corner leads (1, n, n/2 and n/2 + 1) for e8.3, e16.3, e18.3, e28.3, e42.6 will have a b1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). e a -c- c l e e a c e b e c -b- e1 index 12 3 n/2 n area seating base plane plane -c- d1 b1 b e d d1 a a2 l a1 -a- 0.010 (0.25) c a m bs e18.3 (jedec ms-001-bc issue d) 18 lead dual-in-line plastic package symbol inches millimeters notes minmaxminmax a - 0.210 - 5.33 4 a1 0.015 - 0.39 - 4 a2 0.115 0.195 2.93 4.95 - b 0.014 0.022 0.356 0.558 - b1 0.045 0.070 1.15 1.77 8, 10 c 0.008 0.014 0.204 0.355 - d 0.845 0.880 21.47 22.35 5 d1 0.005 - 0.13 - 5 e 0.300 0.325 7.62 8.25 6 e1 0.240 0.280 6.10 7.11 5 e 0.100 bsc 2.54 bsc - e a 0.300 bsc 7.62 bsc 6 e b - 0.430 - 10.92 7 l 0.115 0.150 2.93 3.81 4 n18 189 rev. 0 12/93 icl3221, icl3222, icl3223, icl3232, icl3241, icl3243
18 dual-in-line plastic packages (pdip) notes: 11. controlling dimensions: inch. in case of conflict between english and metric dimensions, the inch dimensions control. 12. dimensioning and tolerancing per ansi y14.5m - 1982. 13. symbols are defined in the ?mo series symbol list? in section 2.2 of publication no. 95. 14. dimensions a, a1 and l are measured with the package seated in jedec seating plane gauge gs - 3. 15. d, d1, and e1 dimensions do not include mold flash or protrusions. mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 16. e and are measured with the leads constrained to be perpen- dicular to datum . 17. e b and e c are measured at the lead tips with the leads uncon- strained. e c must be zero or greater. 18. b1 maximum dimensions do not include dambar protrusions. dam- bar protrusions shall not exceed 0.010 inch (0.25mm). 19. n is the maximum number of terminal positions. 20. corner leads (1, n, n/2 and n/2 + 1) for e8.3, e16.3, e18.3, e28.3, e42.6 will have a b1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). e a -c- c l e e a c e b e c -b- e1 index 12 3 n/2 n area seating base plane plane -c- d1 b1 b e d d1 a a2 l a1 -a- 0.010 (0.25) c a m bs e20.3 (jedec ms-001-ad issue d) 20 lead dual-in-line plastic package symbol inches millimeters notes minmaxminmax a - 0.210 - 5.33 4 a1 0.015 - 0.39 - 4 a2 0.115 0.195 2.93 4.95 - b 0.014 0.022 0.356 0.558 - b1 0.045 0.070 1.55 1.77 8 c 0.008 0.014 0.204 0.355 - d 0.980 1.060 24.89 26.9 5 d1 0.005 - 0.13 - 5 e 0.300 0.325 7.62 8.25 6 e1 0.240 0.280 6.10 7.11 5 e 0.100 bsc 2.54 bsc - e a 0.300 bsc 7.62 bsc 6 e b - 0.430 - 10.92 7 l 0.115 0.150 2.93 3.81 4 n20 209 rev. 0 12/93 icl3221, icl3222, icl3223, icl3232, icl3241, icl3243
19 small outline plastic packages (soic) notes: 21. symbols are defined in the ?mo series symbol list? in section 2.2 of publication number 95. 22. dimensioning and tolerancing per ansi y14.5m - 1982. 23. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 24. dimension ?e? does not include interlead flash or protrusions. interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 25. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 26. ?l? is the length of terminal for soldering to a substrate. 27. ?n? is the number of terminal positions. 28. terminal numbers are shown for reference only. 29. the lead width ?b?, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 30. controlling dimension: millimeter. converted inch dimensions are not necessarily exact. index area e d n 123 -b- 0.25(0.010) c a m bs e -a- l b m -c- a1 a seating plane 0.10(0.004) h x 45 o c h 0.25(0.010) b m m m16.15 (jedec ms-012-ac issue c) 16 lead narrow body small outline plastic package symbol inches millimeters notes min max min max a 0.0532 0.0688 1.35 1.75 - a1 0.0040 0.0098 0.10 0.25 - b 0.013 0.020 0.33 0.51 9 c 0.0075 0.0098 0.19 0.25 - d 0.3859 0.3937 9.80 10.00 3 e 0.1497 0.1574 3.80 4.00 4 e 0.050 bsc 1.27 bsc - h 0.2284 0.2440 5.80 6.20 - h 0.0099 0.0196 0.25 0.50 5 l 0.016 0.050 0.40 1.27 6 n16 167 0 o 8 o 0 o 8 o - rev. 0 12/93 icl3221, icl3222, icl3223, icl3232, icl3241, icl3243
20 thin shrink small outline plastic packages (tssop) index area e1 d n 123 -b- 0.10(0.004) c a m bs e -a- b m -c- a1 a seating plane 0.10(0.004) c e 0.25(0.010) b m m l 0.25 0.010 gauge plane a2 notes: 31. these package dimensions are within allowable dimensions of jedec mo-153-ab, issue e. 32. dimensioning and tolerancing per ansi y14.5m - 1982. 33. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 34. dimension ?e1? does not include interlead flash or protrusions. inter- lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 35. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 36. ?l? is the length of terminal for soldering to a substrate. 37. ?n? is the number of terminal positions. 38. terminal numbers are shown for reference only. 39. dimension ?b? does not include dambar protrusion. allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of ?b? dimen- sion at maximum material condition. minimum space between protru- sion and adjacent lead is 0.07mm (0.0027 inch). 40. controlling dimension: millimeter. converted inch dimensions are not necessarily exact. (angles in degrees) 0.05(0.002) m16.173 16 lead thin shrink small outline plastic package symbol inches millimeters notes min max min max a - 0.047 - 1.20 - a1 0.002 0.006 0.05 0.15 - a2 0.031 0.051 0.80 1.05 - b 0.0075 0.0118 0.19 0.30 9 c 0.0035 0.0079 0.09 0.20 - d 0.193 0.201 4.90 5.10 3 e1 0.169 0.177 4.30 4.50 4 e 0.026 bsc 0.65 bsc - e 0.246 0.256 6.25 6.50 - l 0.0177 0.0295 0.45 0.75 6 n16 167 0 o 8 o 0 o 8 o - rev. 0 6/98 icl3221, icl3222, icl3223, icl3232, icl3241, icl3243
21 small outline plastic packages (ssop) notes: 1. symbols are defined in the ?mo series symbol list? in section 2.2 of publication number 95. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side. 4. dimension ?e? does not include interlead flash or protrusions. interlead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side. 5. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. dimension ?b? does not include dambar protrusion. allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of ?b? dimen- sion at maximum material condition. 10. controlling dimension: millimeter. converted inch dimensions are not necessarily exact. index area e d n 123 -b- 0.25(0.010) c a m bs e -a- l b m -c- a1 a seating plane 0.10(0.004) c h 0.25(0.010) b m m 0.25 0.010 gauge plane a2 m16.209 (jedec mo-150-ac issue b) 16 lead shrink small outline plastic package symbol inches millimeters notes minmaxminmax a - 0.078 - 2.00 - a1 0.002 - 0.05 - - a2 0.065 0.072 1.65 1.85 - b 0.009 0.014 0.22 0.38 9 c 0.004 0.009 0.09 0.25 - d 0.233 0.255 5.90 6.50 3 e 0.197 0.220 5.00 5.60 4 e 0.026 bsc 0.65 bsc - h 0.292 0.322 7.40 8.20 - l 0.022 0.037 0.55 0.95 6 n16 167 0 o 8 o 0 o 8 o - rev. 2 3/95 icl3221, icl3222, icl3223, icl3232, icl3241, icl3243
22 small outline plastic packages (soic) notes: 11. symbols are defined in the ?mo series symbol list? in section 2.2 of publication number 95. 12. dimensioning and tolerancing per ansi y14.5m - 1982. 13. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 14. dimension ?e? does not include interlead flash or protrusions. interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 15. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 16. ?l? is the length of terminal for soldering to a substrate. 17. ?n? is the number of terminal positions. 18. terminal numbers are shown for reference only. 19. the lead width ?b?, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 20. controlling dimension: millimeter. converted inch dimensions are not necessarily exact. index area e d n 123 -b- 0.25(0.010) c a m bs e -a- l b m -c- a1 a seating plane 0.10(0.004) h x 45 o c h 0.25(0.010) b m m m16.3 (jedec ms-013-aa issue c) 16 lead wide body small outline plastic package symbol inches millimeters notes min max min max a 0.0926 0.1043 2.35 2.65 - a1 0.0040 0.0118 0.10 0.30 - b 0.013 0.0200 0.33 0.51 9 c 0.0091 0.0125 0.23 0.32 - d 0.3977 0.4133 10.10 10.50 3 e 0.2914 0.2992 7.40 7.60 4 e 0.050 bsc 1.27 bsc - h 0.394 0.419 10.00 10.65 - h 0.010 0.029 0.25 0.75 5 l 0.016 0.050 0.40 1.27 6 n16 167 0 o 8 o 0 o 8 o - rev. 0 12/93 icl3221, icl3222, icl3223, icl3232, icl3241, icl3243
23 small outline plastic packages (soic) notes: 21. symbols are defined in the ?mo series symbol list? in section 2.2 of publication number 95. 22. dimensioning and tolerancing per ansi y14.5m - 1982. 23. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 24. dimension ?e? does not include interlead flash or protrusions. inter- lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 25. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 26. ?l? is the length of terminal for soldering to a substrate. 27. ?n? is the number of terminal positions. 28. terminal numbers are shown for reference only. 29. the lead width ?b?, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 30. controlling dimension: millimeter. converted inch dimensions are not necessarily exact. index area e d n 123 -b- 0.25(0.010) c a m bs e -a- l b m -c- a1 a seating plane 0.10(0.004) h x 45 o c h 0.25(0.010) b m m m18.3 (jedec ms-013-ab issue c) 18 lead wide body small outline plastic package symbol inches millimeters notes min max min max a 0.0926 0.1043 2.35 2.65 - a1 0.0040 0.0118 0.10 0.30 - b 0.013 0.0200 0.33 0.51 9 c 0.0091 0.0125 0.23 0.32 - d 0.4469 0.4625 11.35 11.75 3 e 0.2914 0.2992 7.40 7.60 4 e 0.050 bsc 1.27 bsc - h 0.394 0.419 10.00 10.65 - h 0.010 0.029 0.25 0.75 5 l 0.016 0.050 0.40 1.27 6 n18 187 0 o 8 o 0 o 8 o - rev. 0 12/93 icl3221, icl3222, icl3223, icl3232, icl3241, icl3243
24 thin shrink small outline plastic packages (tssop) index area e1 d n 123 -b- 0.10(0.004) c a m bs e -a- b m -c- a1 a seating plane 0.10(0.004) c e 0.25(0.010) b m m l 0.25 0.010 gauge plane a2 notes: 31. these package dimensions are within allowable dimensions of jedec mo-153-ac, issue e. 32. dimensioning and tolerancing per ansi y14.5m - 1982. 33. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 34. dimension ?e1? does not include interlead flash or protrusions. inter- lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 35. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 36. ?l? is the length of terminal for soldering to a substrate. 37. ?n? is the number of terminal positions. 38. terminal numbers are shown for reference only. 39. dimension ?b? does not include dambar protrusion. allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of ?b? dimen- sion at maximum material condition. minimum space between protru- sion and adjacent lead is 0.07mm (0.0027 inch). 40. controlling dimension: millimeter. converted inch dimensions are not necessarily exact. (angles in degrees) 0.05(0.002) m20.173 20 lead thin shrink small outline plastic package symbol inches millimeters notes min max min max a - 0.047 - 1.20 - a1 0.002 0.006 0.05 0.15 - a2 0.031 0.051 0.80 1.05 - b 0.0075 0.0118 0.19 0.30 9 c 0.0035 0.0079 0.09 0.20 - d 0.252 0.260 6.40 6.60 3 e1 0.169 0.177 4.30 4.50 4 e 0.026 bsc 0.65 bsc - e 0.246 0.256 6.25 6.50 - l 0.0177 0.0295 0.45 0.75 6 n20 207 0 o 8 o 0 o 8 o - rev. 1 6/98 icl3221, icl3222, icl3223, icl3232, icl3241, icl3243
25 shrink small outline plastic packages (ssop) notes: 41. symbols are defined in the ?mo series symbol list? in section 2.2 of publication number 95. 42. dimensioning and tolerancing per ansi y14.5m - 1982. 43. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side. 44. dimension ?e? does not include interlead flash or protrusions. inter- lead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side. 45. the chamfer on the body is optional. if it is not present, a visual in- dex feature must be located within the crosshatched area. 46. ?l? is the length of terminal for soldering to a substrate. 47. ?n? is the number of terminal positions. 48. terminal numbers are shown for reference only. 49. dimension ?b? does not include dambar protrusion. allowable dam- bar protrusion shall be 0.13mm (0.005 inch) total in excess of ?b? dimension at maximum material condition. 50. controlling dimension: millimeter. converted inch dimensions are not necessarily exact. index area e d n 123 -b- 0.25(0.010) c a m bs e -a- l b m -c- a1 a seating plane 0.10(0.004) c h 0.25(0.010) b m m 0.25 0.010 gauge plane a2 m20.209 (jedec mo-150-ae issue b) 20 lead shrink small outline plastic package symbol inches millimeters notes min max min max a - 0.078 - 2.00 - a1 0.002 - 0.05 - - a2 0.065 0.072 1.65 1.85 - b 0.009 0.014 0.22 0.38 9 c 0.004 0.009 0.09 0.25 - d 0.272 0.295 6.90 7.50 3 e 0.197 0.220 5.00 5.60 4 e 0.026 bsc 0.65 bsc - h 0.292 0.322 7.40 8.20 - l 0.022 0.037 0.55 0.95 6 n20 207 0 o 8 o 0 o 8 o - rev. 2 4/95 icl3221, icl3222, icl3223, icl3232, icl3241, icl3243
26 thin shrink small outline plastic packages (tssop) index area e1 d n 123 -b- 0.10(0.004) c a m bs e -a- b m -c- a1 a seating plane 0.10(0.004) c e 0.25(0.010) b m m l 0.25 0.010 gauge plane a2 notes: 51. these package dimensions are within allowable dimensions of jedec mo-153-ae, issue e. 52. dimensioning and tolerancing per ansi y14.5m - 1982. 53. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 54. dimension ?e1? does not include interlead flash or protrusions. inter- lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 55. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 56. ?l? is the length of terminal for soldering to a substrate. 57. ?n? is the number of terminal positions. 58. terminal numbers are shown for reference only. 59. dimension ?b? does not include dambar protrusion. allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of ?b? dimen- sion at maximum material condition. minimum space between protru- sion and adjacent lead is 0.07mm (0.0027 inch). 60. controlling dimension: millimeter. converted inch dimensions are not necessarily exact. (angles in degrees) 0.05(0.002) m28.173 28 lead thin shrink small outline plastic package symbol inches millimeters notes min max min max a - 0.047 - 1.20 - a1 0.002 0.006 0.05 0.15 - a2 0.031 0.051 0.80 1.05 - b 0.0075 0.0118 0.19 0.30 9 c 0.0035 0.0079 0.09 0.20 - d 0.378 0.386 9.60 9.80 3 e1 0.169 0.177 4.30 4.50 4 e 0.026 bsc 0.65 bsc - e 0.246 0.256 6.25 6.50 - l 0.0177 0.0295 0.45 0.75 6 n28 287 0 o 8 o 0 o 8 o - rev. 0 6/98 icl3221, icl3222, icl3223, icl3232, icl3241, icl3243
27 shrink small outline plastic packages (ssop) notes: 61. symbols are defined in the ?mo series symbol list? in section 2.2 of publication number 95. 62. dimensioning and tolerancing per ansi y14.5m - 1982. 63. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side. 64. dimension ?e? does not include interlead flash or protrusions. in- terlead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side. 65. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 66. ?l? is the length of terminal for soldering to a substrate. 67. ?n? is the number of terminal positions. 68. terminal numbers are shown for reference only. 69. dimension ?b? does not include dambar protrusion. allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of ?b? dimension at maximum material condition. 70. controlling dimension: millimeter. converted inch dimensions are not necessarily exact. index area e d n 123 -b- 0.25(0.010) c a m bs e -a- l b m -c- a1 a seating plane 0.10(0.004) c h 0.25(0.010) b m m 0.25 0.010 gauge plane a2 m28.209 (jedec mo-150-ah issue b) 28 lead shrink small outline plastic package symbol inches millimeters notes min max min max a - 0.078 - 2.00 - a1 0.002 - 0.05 - - a2 0.065 0.072 1.65 1.85 - b 0.009 0.014 0.22 0.38 9 c 0.004 0.009 0.09 0.25 - d 0.390 0.413 9.90 10.50 3 e 0.197 0.220 5.00 5.60 4 e 0.026 bsc 0.65 bsc - h 0.292 0.322 7.40 8.20 - l 0.022 0.037 0.55 0.95 6 n28 287 0 o 8 o 0 o 8 o - rev. 1 3/95 icl3221, icl3222, icl3223, icl3232, icl3241, icl3243
28 all intersil products are manufactured, assembled and tested utilizing iso9000 quality systems. intersil corporation?s quality certifications can be viewed at www.intersil.com/design/quality intersil products are sold by description only. intersil corporation reserves the right to make changes in circuit design and/o r specifications at any time without notice. accordingly, the reader is cautioned to verify that data sheets are current before placing orders. information furnished by int ersil is believed to be accurate and reliable. however, no responsibility is assumed by intersil or its subsidiaries for its use; nor for any infringements of patents or othe r rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of intersil or its subsidiaries. for information regarding intersil corporation and its products, see www.intersil.com sales office headquarters north america intersil corporation 7585 irvine center drive suite 100 irvine, ca 92618 tel: (949) 341-7000 fax: (949) 341-7123 intersil corporation 2401 palm bay rd. palm bay, fl 32905 tel: (321) 724-7000 fax: (321) 724-7946 europe intersil europe sarl ave. c - f ramuz 43 ch-1009 pully switzerland tel: +41 21 7293637 fax: +41 21 7293684 asia intersil corporation unit 1804 18/f guangdong water building 83 austin road tst, kowloon hong kong tel: +852 2723 6339 fax: +852 2730 1433 small outline plastic packages (soic) notes: 71. symbols are defined in the ?mo series symbol list? in section 2.2 of publication number 95. 72. dimensioning and tolerancing per ansi y14.5m - 1982. 73. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 74. dimension ?e? does not include interlead flash or protrusions. in- terlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 75. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 76. ?l? is the length of terminal for soldering to a substrate. 77. ?n? is the number of terminal positions. 78. terminal numbers are shown for reference only. 79. the lead width ?b?, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 80. controlling dimension: millimeter. converted inch dimen- sions are not necessarily exact. index area e d n 123 -b- 0.25(0.010) c a m bs e -a- l b m -c- a1 a seating plane 0.10(0.004) h x 45 o c h 0.25(0.010) b m m m28.3 (jedec ms-013-ae issue c ) 28 lead wide body small outline plastic package symbol inches millimeters notes minmaxminmax a 0.0926 0.1043 2.35 2.65 - a1 0.0040 0.0118 0.10 0.30 - b 0.013 0.0200 0.33 0.51 9 c 0.0091 0.0125 0.23 0.32 - d 0.6969 0.7125 17.70 18.10 3 e 0.2914 0.2992 7.40 7.60 4 e 0.05 bsc 1.27 bsc - h 0.394 0.419 10.00 10.65 - h 0.01 0.029 0.25 0.75 5 l 0.016 0.050 0.40 1.27 6 n28 287 0 o 8 o 0 o 8 o - rev. 0 12/93 icl3221, icl3222, icl3223, icl3232, icl3241, icl3243

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